Andrew Arthur Ketterson

5 Patents

• US119293002024

  Method for Packaging an Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)

  Qorvo US, Inc.

  0 cites
• US119088082024

  Monolithic Microwave Integrated Circuit (MMIC) with Embedded Transmission Line (ETL) Ground Shielding

  Qorvo US, Inc.

  0 cites
• US117913122023

  Mmics with Backside Interconnects for Fanout-style Packaging

  Qorvo US, Inc.

  0 cites
• US116263402023

  Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)

  Qorvo US, Inc.

  0 cites
• US115575452023

  Monolithic Microwave Integrated Circuit (MMIC) with Embedded Transmission Line (ETL) Ground Shielding

  Qorvo US, Inc.

  0 cites