Andres Ramirez Macias

3 Patents

• US125047992025

  Flexible and Modular Top and Bottom Side Processor Unit Module Cooling

  Intel Corporation

  0 cites
• US122939562025

  Boiling Enhancement Structures for Immersion Cooled Electronic Systems

  Intel Corporation

  0 cites
• US120559862024

  Flexible and Modular Top and Bottom Side Processor Unit Module Cooling

  Intel Corporation

  0 cites