Andrej Kolbasow

6 Patents

• US124855002025

  Method for Monitoring a Laser Soldering Process, and Laser Soldering System Using a Spectroscope Device

  PAC TECH—PACKAGING TECHNOLOGIES GmbH

  0 cites
• US123580842025

  Bonding Head and Bonding Apparatus

  Pac Tech—packaging Technologies GmbH

  0 cites
• US123492872025

  Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole

  Pac Tech—packaging Technologies GmbH

  0 cites
• US121710662024

  Method for Removing and Repositioning Electronic Components Connected to a Circuit Board

  Pac Tech—packaging Technologies GmbH

  0 cites
• US120237562024

  Method for Removing Electronic Components Connected to a Circuit Board

  Pac Tech—packaging Technologies GmbH

  0 cites
• US120289872024

  Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole

  Pac Tech—packaging Technologies GmbH

  0 cites