13 Patents
- US125015512025Method for Embedding a Component in a Printed Circuit Board
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US124245042025Component Embedded in Component Carrier and Having an Exposed Side Wall
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US124009682025Component with Dielectric Layer for Embedding in Component Carrier
At&saustria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US123825852025Method for Embedding a Component in a Printed Circuit Board
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US121854782024Printed Circuit Board Having Embedded Component
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US121659402024Component Carrier with Surface-contactable Component Embedded in Laminated Stack
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US120755612024Embedding Component in Component Carrier by Component Fixation Structure
At&saustria Technologie & Systemtechnik AG
0 cites - US117495732023Component Carrier with a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US117496132023Component with Dielectric Layer for Embedding in Component Carrier
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US116826612023Hermetic Optical Component Package Having Organic Portion and Inorganic Portion
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US116581422023Connection Arrangement, Component Carrier and Method of Forming a Component Carrier Structure
At&saustria Technologie & Systemtechnik AG
0 cites - US115708972023Component Embedded in Component Carrier and Having an Exposed Side Wall
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites