9 Patents
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- US122118242025Power Semiconductor Package Having First and Second Lead Frames
Infineon Technologies AG
0 cites - US121659592024Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
Infineon Technologies AG
0 cites - US119730122024Power Module with Semiconductor Packages Mounted on Metal Frame
Infineon Technologies Austria AG
0 cites - US119087602024Package with Encapsulated Electronic Component Between Laminate and Thermally Conductive Carrier
Infineon Technologies AG
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- US116263512023Semiconductor Package with Barrier to Contain Thermal Interface Material
Infineon Technologies AG
0 cites - US115989042023Power Semiconductor Module and Method for Producing a Power Semiconductor Module
Infineon Technologies AG
0 cites - US115748892023Power Module Comprising Two Substrates and Method of Manufacturing the Same
Infineon Technologies AG
0 cites