8 Patents
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- US1237278020253D Dome Wafer-level Package for Optical Mems Mirror with Reduced Footprint
Infineon Technologies AG
0 cites - US120602662024Method with Mechanical Dicing Process for Producing MEMS Components
Infineon Technologies AG
0 cites - US119905202024Method of Manufacturing a Semiconductor Device Having Frame Structures Laterally Surrounding Backside Metal Structures
INFINEON TECHNOLOGIES AG
0 cites - US119392162024Method with Stealth Dicing Process for Fabricating MEMS Semiconductor Chips
Infineon Technologies AG
0 cites - US117876862023Method for Processing a Layer Structure and Microelectromechanical Component
Infineon Technologies AG
0 cites - US115762592023Carrier, Laminate and Method of Manufacturing Semiconductor Devices
Infineon Technologies AG
0 cites