Anand Nilakantan Iyer

4 Patents

• US125337712026

  Polishing Slurry Dispense Nozzle

  Applied Materials, Inc.

  0 cites
• US123879782025

  Ru Liner Above a Barrier Layer

  APPLIED MATERIALS, Inc.

  0 cites
• US118199762023

  Spray System for Slurry Reduction During Chemical Mechanical Polishing (cmp)

  Applied Materials, Inc.

  0 cites
• US117943052023

  Platen Surface Modification and High-performance Pad Conditioning to Improve CMP Performance

  Applied Materials, Inc.

  0 cites