Amy R. Griffin

3 Patents

• US125885022026

  Methods and Apparatus for Integrating Carbon Nanofiber Into Semiconductor Devices Using W2W Fusion Bonding

  Micron Technology, Inc.

  0 cites
• US125820012026

  Methods for Fusion Bonding Semiconductor Devices to Temporary Carrier Wafers with Cavity Regions for Reduced Bond Strength, and Semiconductor Device Assemblies Formed by the Same

  Micron Technology, Inc.

  0 cites
• US120786722024

  Heat Spreaders for Use in Semiconductor Device Testing, Such as Burn-in Testing

  Micron Technology, Inc.

  0 cites