Amruthavalli Pallavi Alur

8 Patents

• US124009522025

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites
• US122726502025

  Microelectronic Package with Substrate Cavity for Bridge-attach

  Intel Corporation

  0 cites
• US120465602024

  Microelectronic Device with Embedded Die Substrate on Interposer

  Intel Corporation

  0 cites
• US119232572024

  Hybrid Microelectronic Substrates

  Intel Corporation

  0 cites
• US119087932024

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites
• US118943112024

  Microelectronic Device with Embedded Die Substrate on Interposer

  Intel Corporation

  0 cites
• US117641582023

  Embedded Multi-die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same

  Intel Corporation

  0 cites
• US116581112023

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites