Amruthavalli P. Alur

7 Patents

• US123277732025

  Package with Underfill Containment Barrier

  Intel Corporation

  0 cites
• US119554262024

  Package-integrated Multi-turn Coil Embedded in a Package Magnetic Core

  Intel Corporation

  0 cites
• US119358052024

  Package with Underfill Containment Barrier

  Intel Corporation

  0 cites
• US117053772023

  Stacked Die Cavity Package

  Intel Corporation

  0 cites
• US116642902023

  Package with Underfill Containment Barrier

  Intel Corporation

  0 cites
• US115812712023

  Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate

  Intel Corporation

  0 cites
• US115520192023

  Substrate Patch Reconstitution Options

  Intel Corporation

  0 cites