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Amruthavalli Alur
Tempe, AZ
US
3 patents
4 Patents
US12476174
2025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US12406914
2025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US12336196
2025
Magnetic Core Inductors on Package Substrates
Intel Corporation
0 cites
US11676950
2023
Via-in-via Structure for High Density Package Integrated Inductor
Intel Corporation
0 cites