Patents/Inventors

Amram Eitan

HsinchuTW7 patents

7 Patents

US125754542026
Bonding Structures for Semiconductor Devices and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125061092025
Die Bonding Tool with Tiltable Bond Head for Improved Bonding and Methods for Performing the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites
US116769002023
Electronic Assembly That Includes a Bridge
Intel Corporation
0 cites