Amit Sureshkumar Nangia

4 Patents

• US122939482025

  Flip Chip Semiconductor Device Package with Mold Compound Seal

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• US121192802024

  Semiconductor Device Package with Reduced Stress

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• US120682612024

  Strain-induced Shift Mitigation in Semiconductor Packages

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• US118698202024

  IC Having a Metal Ring Thereon for Stress Reduction

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