3 Patents
- US117356892023Dielectric-dielectric and Metallization Bonding via Plasma Activation and Laser-induced Heating
Meta Platforms Technologies, LLC
0 cites - US115750692023Employing Deformable Contacts and Pre-applied Underfill for Bonding LED Devices via Lasers
Meta Platforms Technologies, LLC
0 cites - US115631422023Curing Pre-applied and Plasma-etched Underfill via a Laser
Meta Platforms Technologies, LLC
0 cites