Patents/Inventors

Alexander Heinrich

ZugCH35 patents

28 Patents

US126170462026
Method for Attaching a First Connection Partner to a Second Connection Partner
Infineon Technologies AG
0 cites
USD11218132026
Grip for a Medical Injector
SHL Medical AG
0 cites
US125819812026
Method of Forming an Interconnection Between an Electric Component and an Electronic Component
Infineon Technologies Austria AG
0 cites
US124656952025
Data Collection Apparatus for Attachment to an Injection Device
Sanofi
0 cites
US123478052025
Inkjet Printing of Diffusion Solder
Infineon Technologies Austria AG
0 cites
US123302432025
Method of Forming an Intermetallic Phase Layer with a Plurality of Nickel Particles
Infineon Technologies AG
0 cites
US122611442025
Semiconductor Device and Method for Fabricating a Semiconductor Device
Infineon Technologies Austria AG
0 cites
US122551682025
Electronic Device with Multi-layer Contact and System
Infineon Technologies AG
0 cites
US122058702025
Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites
US121660052024
Semiconductor Device Having a Soldered Joint with One or More Intermetallic Phases
Infineon Technologies Austria AG
0 cites
US120698022024
Pre-plating of Solder Layer on Solderable Elements for Diffusion Soldering
Infineon Technologies AG
0 cites
US120646062024
Data Collection Apparatus for Attachment to an Injection Device
Sanofi-aventis Deutschland GmbH
0 cites
US120274902024
Semiconductor Device and Method for Fabricating the Same
Infineon Technologies AG
0 cites
US120237622024
Layer Structure with an Intermetallic Phase Layer and a Chip Package That Includes the Layer Structure
Infineon Technologies AG
0 cites
US119447962024
Data Collection Apparatus for Attachment to an Injection Device
Sanofi-aventis Deutschland GmbH
0 cites
US119088302024
Semiconductor Device and Method for Fabricating the Same
Infineon Technologies AG
0 cites
US118653132024
Data Collection Apparatus for Attachment to an Injection Device
Sanofi-aventis Deutschland GmbH
0 cites
US118626002024
Method of Forming a Chip Package and Chip Package
Infineon Technologies AG
0 cites
US118429752023
Electronic Device with Multi-layer Contact and System
Infineon Technologies AG
0 cites
US118174172023
Semiconductor Device and Method for Fabricating a Semiconductor Device
Infineon Technologies Austria AG
0 cites
US117769272023
Semiconductor Device Including a Solder Compound Containing a Compound Sn/sb
Infineon Technologies AG
0 cites
US117308912023
Data Collection Apparatus for Attachment to an Injection Device
Sanofi-aventis Deutschland GmbH
0 cites
US116886702023
Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites
US116520842023
Flat Lead Package Formation Method
Infineon Technologies AG
0 cites
US116056082023
Preform Diffusion Soldering
Infineon Technologies Austria AG
0 cites
US115842002023
Arrangement for Operating One or More Windows Installed in a Vehicle
Continental Automotive GmbH
0 cites
US115478062023
Data Collection Apparatus for Attachment to an Injection Device
Sanofi-aventis Deutschland GmbH
0 cites
US115520422023
Solder Material with Two Different Size Nickel Particles
Infineon Technologies AG
0 cites