7 Patents
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- US119528882024Data Communication in the Microwave Range Using Electrically Conductive Elements in a Construction Machine
Herrenknecht AG
0 cites - US119489122024Method of Manufacturing a Bonded Substrate Stack by Surface Activation
Infineon Technologies AG
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- US118309622023Method for Structuring an Insulating Layer on a Semiconductor Wafer
AZUR SPACE Solar Power GmbH
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