Patents/Inventors

Alexander Fluegel

LudwigshafenDE10 patents

8 Patents

US126069252026
Composition for Copper Bump Electrodeposition Comprising a Leveling Agent
BASF SE
0 cites
US125598522026
Composition for Tin-silver Alloy Electroplating Comprising a Complexing Agent
BASF SE
0 cites
US125097902025
Composition for Tin or Tin Alloy Electroplating Comprising Leveling Agent
BASF SE
0 cites
US121348342024
Composition for Copper Bump Electrodeposition Comprising a Polyaminoamide Type Leveling Agent
BASF SE
0 cites
US120984732024
Composition for Cobalt Plating Comprising Additive for Void-free Submicron Feature Filling
BASF SE
0 cites
US120548422024
Composition for Tin-silver Alloy Electroplating Comprising a Complexing Agent
BASF SE
0 cites
US119269182024
Composition for Metal Plating Comprising Suppressing Agent for Void Free Filing
BASF SE
0 cites
US118407712023
Composition for Tin or Tin Alloy Electroplating Comprising Suppressing Agent
BASF SE
0 cites