Patents/Inventors

Aleksandar Aleksov

Chandler, AZUS91 patents

86 Patents

US126046702026
In-package Magnetic Switching Using Glass Core Technology
Intel Corporation
0 cites
US126047442026
Integration of Glass Core Into Electronic Substrates for Fine Pitch Die Tiling
Intel Corporation
0 cites
US125989972026
Inductor with Integrated Magnetics
Intel Corporation
0 cites
US125737442026
Wideband Antennas in Glass Through Direct via Feeding and Glass Stacking
Intel Corporation
0 cites
US125507682026
Conformal Power Delivery Structures Near High-speed Signal Traces
Intel Corporation
0 cites
US125423582026
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US125123962025
Flexible Die to Floor Planning with Bump Pitch Scale Through Glass Core via Pitch
Intel Corporation
0 cites
US124944432025
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
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US124890322025
Cooling of Conformal Power Delivery Structures
Intel Corporation
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US124761752025
Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US124567022025
Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites
US124567052025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US124446192025
Physical Vapor Deposition Seeding for High Aspect Ratio Vias in Glass Core Technology
Intel Corporation
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US124446722025
Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
0 cites
US124380872025
High Throughput Additive Manufacturing for Integrated Circuit Components Containing Traces with Feature Size and Grain Boundaries
Intel Corporation
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US124314302025
Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components
Intel Corporation
0 cites
US124247162025
RF Filters and Multiplexers Manufactured in the Core of a Package Substrate Using Glass Core Technology
Intel Corporation
0 cites
US124247192025
Compact Surface Transmission Line Waveguides with Vertical Ground Planes
Intel Corporation
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US123811822025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US123680912025
Package Substrate with Glass Core Having Vertical Power Planes for Improved Power Delivery
Intel Corporation
0 cites
US123549922025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123477612025
Magnetic Planar Spiral and High Aspect Ratio Inductors for Power Delivery in the Glass-core of a Package Substrate
Intel Corporation
0 cites
US123492822025
Capacitors in Through Glass Vias
Intel Corporation
0 cites
US123277752025
Thermal Performance in Hybrid Bonded 3D Die Stacks
Intel Corporation
0 cites
US122887512025
Microelectronic Assemblies
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US122610972025
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US122551302025
Airgap Structures for High Speed Signal Integrity
Intel Corporation
0 cites
US122552252025
Low Leakage Thin Film Capacitors Using Titanium Oxide Dielectric with Conducting Noble Metal Oxide Electrodes
Intel Corporation
0 cites
US122422902025
Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
0 cites
US122180692025
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US122059022025
High-density Interconnects for Integrated Circuit Packages
Intel Corporation
0 cites
US121990182025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US121839612024
Methods for Conductively Coating Millimeter Waveguides
Intel Corporation
0 cites
US121762232024
Integrated Circuit Package Supports
Intel Corporation
0 cites
US121763232024
Microelectronic Assemblies
Intel Corporation
0 cites
US121659622024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121659942024
Radio Frequency Antennas and Waveguides for Communication Between Integrated Circuit Devices
Intel Corporation
0 cites
US121551332024
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US121553722024
Multi-filter Die
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121425102024
Carrier for Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121365962024
Microelectronic Assemblies
Intel Corporation
0 cites
US121192912024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121130262024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US120626312024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corporation
0 cites
US120574022024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US120407762024
Integrated Radio Frequency (RF) Front-end Module (FEM)
Intel Corporation
0 cites
US120274662024
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites
US120071702024
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US119904482024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119423342024
Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites
US119358572024
Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
0 cites
US119088022024
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US118943242024
In-package RF Waveguides as High Bandwidth Chip-to-chip Interconnects and Methods for Using the Same
Intel Corporation
0 cites
US118760532024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US118548342023
Integrated Circuit Package Supports
Intel Corporation
0 cites
US118375342023
Substrate with Variable Height Conductive and Dielectric Elements
Intel Corporation
0 cites
US118307872023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US118308312023
Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites
US118240082023
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US118044552023
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
0 cites
US117915282023
Low Loss and Low Cross Talk Transmission Lines with Stacked Dielectric Layers for Forming Stubs of Different Thickness or for Forming a Coaxial Line
Intel Corporation
0 cites
US117841082023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117841812023
Die Backend Diodes for Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117697342023
Microelectronic Assemblies
Intel Corporation
0 cites
US117569482023
In Situ Package Integrated Thin Film Capacitors for Power Delivery
Intel Corporation
0 cites
US117513672023
Microelectronic Package Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117282582023
Electroless Metal-defined Thin Pad First Level Interconnects for Lithographically Defined Vias
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117216502023
Method for Fabricating Multiplexed Hollow Waveguides of Variable Type on a Semiconductor Package
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US116949512023
Zero-misalignment Two-via Structures
Intel Corporation
0 cites
US116949622023
Microelectronic Package with Mold-integrated Components
Intel Corporation
0 cites
US116886602023
Bridge for Radio Frequency (RF) Multi-chip Modules
Intel Corporation
0 cites
US116769182023
Electrostatic Discharge Protection in Integrated Circuits
Intel Corporation
0 cites
US116643032023
Interconnection Structure Fabrication Using Grayscale Lithography
Intel Corporation
0 cites
US116584182023
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US116417112023
Microelectronic Package with Substrate-integrated Components
Intel Corporation
0 cites
US116211922023
Inorganic Dies with Organic Interconnect Layers and Related Structures
Intel Corporation
0 cites
US116212362023
Electrostatic Discharge Protection in Integrated Circuits Using Positive Temperature Coefficient Material
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US116058672023
Fabricating an RF Filter on a Semiconductor Package Using Selective Seeding
Intel Corporation
0 cites