Albrecht Ullrich

5 Patents

• US125395652026

  Method for Producing Short Subcritical Cracks in Solid Bodies

  Siltectra GmbH

  0 cites
• US121070172024

  Method and Apparatus for Producing at Least One Modification in a Solid Body

  INFINEON TECHNOLOGIES AG

  0 cites
• US120302162024

  Method for Separating Wafers from Donor Substrates

  Siltectra GmbH

  0 cites
• US117870832023

  Production Facility for Separating Wafers from Donor Substrates

  Siltectra GmbH

  0 cites
• US115519812023

  Method and Apparatus for Producing at Least One Modification in a Solid Body

  Infineon Technologies AG

  0 cites