2 Patents
- US123840812025Mould Half and Mould Method for Transfer Moulding Encapsulating Electronic Components Mounted on a Carrier Including a Dual Support Surface and a Method for Using Such
Besi Netherlands B.V.
0 cites - US115545232023Press Part for Supporting a Mould Part for Encapsulating Electronic Components Mounted on a Carrier and a Press Comprising the Press Part
Besi Netherlands B.V.
0 cites