7 Patents
- 0 cites
- US122782022025Modular Construction of Hybrid-bonded Semiconductor Die Assemblies and Related Systems and Methods
Micron Technology, Inc.
0 cites - US122551632025Bond Pads for Semiconductor Die Assemblies and Associated Methods and Systems
Micron Technology, Inc.
0 cites - 0 cites
- US119730622024High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites - US116316442023High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites - US115879122023High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites