Patents/Inventors

Akira Yamauchi

KyotoJP11 patents

13 Patents

US124096442025
Substrate Bonding Method and Substrate Bonding System
BONDTECH CO., Ltd.
0 cites
US123880452025
Bonding System and Bonding Method
BONDTECH CO., Ltd.
0 cites
US123815262025
Amplifier Circuit and Sensor Circuit
Toshiba Electronic Devices & Storage Corporation
0 cites
US123410362025
Resin Shaping Device
BONDTECH CO., Ltd.
0 cites
US122833702025
Facility Presentation Apparatus, Facility Presentation Method and Recording Medium
NEC Solution Innovators, Ltd.
0 cites
US122670522025
Power Amplifying Device
Toshiba Electronic Devices & Storage Corporation
0 cites
US122610702025
Component Mounting System and Component Mounting Method
BONDTECH CO., Ltd.
0 cites
US122611472025
Bonding System and Bonding Method
BONDTECH CO., Ltd.
0 cites
US121870102025
Glass Structure, Adhesive Structure, and Method for Producing Glass Structure
AGC Inc.
0 cites
US120947472024
Substrate Bonding Device
BONDTECH CO., Ltd.
0 cites
US118589842024
Anti-s100a8/a9 Antibody and Use Thereof
National University Corporation Gunma University
0 cites
US118374442023
Substrate Joining Method, Substrate Joining System and Method for Controlling Hydrophilic Treatment Device
BONDTECH CO., Ltd.
0 cites
US115878042023
Component Mounting System
BONDTECH CO., Ltd.
0 cites