Patents/Inventors

Akira Sugawara

TokyoJP3 patents

4 Patents

US123005122025
Metal/ceramic Bonding Substrate and Method for Producing Same
DOWA METALTECH CO., Ltd.
0 cites
US121348142024
Cu—ni—si-based Copper Alloy Sheet Material, Method for Producing Same, and Current-carrying Component
DOWA METALTECH CO., Ltd.
0 cites
US119192882024
Method for Producing Heat Radiation Member
DOWA METALTECH CO., Ltd.
0 cites
US119126882024
1, 3-dioxolane Derivative
Tohoku University
0 cites