Akira Motohashi

4 Patents

• US121257542024

  Sensor Package Substrate, Sensor Module Including the Same, and Electronic Component Embedded Substrate

  TDK CORPORATION

  0 cites
• US120599152024

  Thermal Transfer Image Receiving Sheet

  TOPPAN Inc.

  0 cites
• US119729472024

  Manufacturing Method for Semiconductor Laminated Film, and Semiconductor Laminated Film

  National Institute Of Information And Communications Technology

  0 cites
• US118401082023

  Thermal Transfer Ribbon

  TOPPAN PRINTING CO., Ltd.

  0 cites