Akihiro Nishida

3 Patents

• US123449312025

  Method of Producing Copper-containing Layer

  ADEKA CORPORATION

  0 cites
• US116239352023

  Raw Material for Forming Thin Film by Atomic Layer Deposition Method, Method of Producing Thin Film, and Alkoxide Compound

  ADEKA CORPORATION

  0 cites
• US116187622023

  Compound, Raw Material for Forming Thin Film, Method for Manufacturing Thin Film, and Amidine Compound

  ADEKA CORPORATION

  0 cites