Patents/Inventors

Ahmet Tokuz

Santa Clara, CAUS2 patents

3 Patents

US122161622025
Performing Scan Data Transfer Inside Multi-die Package with Serdes Functionality
ADVANCED MICRO DEVICES, Inc.
0 cites
US120990912024
Cost-saving Scheme for Scan Testing of 3D Stack Die
Advanced Micro Devices, Inc.
0 cites
US117620172023
Performing Scan Data Transfer Inside Multi-die Package with SERDES Functionality
ADVANCED MICRO DEVICES, Inc.
0 cites