Patents/Inventors

Ahmer Syed

San Diego, CAUS1 patent

2 Patents

US125001882025
Flip-chip Bumping Metal Layer and Bump Structure
QUALCOMM INCORPORATED
0 cites
US122180412025
Integrated Circuit (IC) Packages Employing a Capacitor-embedded, Redistribution Layer (RDL) Substrate for Interfacing an IC Chip(s) to a Package Substrate, and Related Methods
QUALCOMM INCORPORATED
0 cites