4 Patents
- US122835352025IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119843772024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119358082024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119232672024IC Die with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites