3 Patents
- US124890422025Device Having Solder Bump Structure for Improved Mechanical, Electrical, And/or Thermal Performance
Avago Technologies International Sales Pte. Limited
0 cites - US120027412024Structure for Improved Mechanical, Electrical, And/or Thermal Performance Having Solder Bumps with Different Lengths
Avago Technologies International Sales Pte. Limited
0 cites - US116107382023Low Profile Passive Components and Devices and Packages Including the Same
Avago Technologies International Sales Pte, Limited
0 cites