Patents/Inventors

Aenee Jang

Suwon-siKR21 patents

13 Patents

US126047752026
Semiconductor Chip and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125885672026
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US125816642026
Semiconductor Package and Method of Manufacturing Same
Samsung Electronics Co., Ltd.
0 cites
US123478192025
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123410742025
Semiconductor Package with Increased Thermal Dissipation
Samsung Electronics Co., Ltd.
0 cites
US122372902025
Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US121912382025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118626132024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118108982023
Semiconductor Package and Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116006012023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115945162023
Semiconductor Package and Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812342023
Semiconductor Package with Improved Heat Dissipation
Samsung Electronics Co., Ltd.
0 cites
US115812482023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites