39 Patents
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Intel Corporation
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Intel Corporation
0 cites - US124567022025Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites - US124380872025High Throughput Additive Manufacturing for Integrated Circuit Components Containing Traces with Feature Size and Grain Boundaries
Intel Corporation
0 cites - US124314302025Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components
Intel Corporation
0 cites - US124245432025Selective Interconnects in Back-end-of-line Metallization Stacks of Integrated Circuitry
Intel Corporation
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- US123157942025Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
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- US122887462025Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites - US122887502025Conformal Power Delivery Structure for Direct Chip Attach Architectures
Intel Corporation
0 cites - US122668402025Waveguide Interconnects for Semiconductor Packages and Related Methods
Intel Corporation
0 cites - US122422902025Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
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- US121990122025Modular Microchannel Thermal Solutions for Integrated Circuit Devices
Intel Corporation
0 cites - US121702442024High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
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- US119904192024Physically Unclonable Function Circuitry of a Package Substrate and Method of Providing Same
Intel Corporation
0 cites - US119335552024Heat Dissipation Device Having Anisotropic Thermally Conductive Sections and Isotropic Thermally Conductive Sections
Intel Corporation
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- US118428262023Additive Manufacturing for Integrated Circuit Assembly Connector Support Structures
Intel Corporation
0 cites - US118308312023Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites - US118239722023Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
0 cites - US117496492023Composite IC Chips Including a Chiplet Embedded Within Metallization Layers of a Host IC Chip
Intel Corporation
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- US116212082023Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
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- US115948012023Mmwave Dielectric Waveguide Interconnect Topology for Automotive Applications
Intel Corporation
0 cites - US115812382023Heat Spreading Layer Integrated Within a Composite IC Die Structure and Methods of Forming the Same
Intel Corporation
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