Patents/Inventors

Adel A. Elsherbini

Tempe, AZUS80 patents

74 Patents

US126223172026
Packaging Architecture for Modular Die Interoperability
Intel Corporation
0 cites
US125990332026
Quasi-monolithic Integrated Packaging Architecture with Mid-die Serializer/deserializer
Intel Corporation
0 cites
US125819682026
Package Architecture of Large Dies Using Quasi-monolithic Chip Layers
Intel Corporation
0 cites
US125819382026
Package Architecture for Quasi-monolithic Chip with Backside Power
Intel Corporation
0 cites
US125507812026
Template Structure for Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125002072025
Packaging Architecture with Intermediate Routing Layers
Intel Corporation
0 cites
US125001772025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US124698202025
Fine-grained Disaggregated Server Architecture
Intel Corporation
0 cites
US124631562025
Packaging Architectures for Sub-terahertz Radio Frequency Devices
Intel Corporation
0 cites
US124245892025
Contiguous Shield Structures in Microelectronic Assemblies Having Hybrid Bonding
Intel Corporation
0 cites
US124179782025
Microelectronic Assemblies Having Backside Die-to-package Interconnects
Intel Corporation
0 cites
US124128812025
Microelectronic Assemblies
Intel Corporation
0 cites
US124069622025
Power Delivery Through Capacitor-dies in a Multi-layered Microelectronic Assembly
Intel Corporation
0 cites
US123811822025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US123622972025
Semiconductor Packages with Antennas
Intel Corporation
0 cites
US123411142025
Microelectronic Assemblies Having a Hybrid Bonded Interposer for Die-to-die Fan-out Scaling
Intel Corporation
0 cites
US123278272025
Microelectronic Assemblies
Intel Corporation
0 cites
US123158402025
Microelectronic Assemblies
Intel Corporation
0 cites
US123083622025
Packaging Architecture for Disaggregated Integrated Voltage Regulators
Intel Corporation
0 cites
US123006662025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US123006262025
Microelectronic Assemblies
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US122180692025
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US121990632025
Microelectronic Assemblies
Intel Corporation
0 cites
US121990672025
Scalable Embedded Silicon Bridge via Pillars in Lithographically Defined Vias, and Methods of Making Same
Intel Corporation
0 cites
US121990182025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US121839612024
Methods for Conductively Coating Millimeter Waveguides
Intel Corporation
0 cites
US121763232024
Microelectronic Assemblies
Intel Corporation
0 cites
US121659622024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121487472024
Gallium Nitride (GAN) Three-dimensional Integrated Circuit Technology
Intel Corporation
0 cites
US121425102024
Carrier for Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121192912024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121130482024
Microelectronic Assemblies
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US121005412024
Embedded Cooling Channel in Magnetics
Intel Corporation
0 cites
US120806522024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US120626312024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corporation
0 cites
US120574022024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US119904482024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119844392024
Microelectronic Assemblies
Intel Corporation
0 cites
US119675802024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119160202024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119160062024
Microelectronic Assemblies Having an Integrated Voltage Regulator Chiplet
Intel Corporation
0 cites
US119088022024
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US119013302024
Microelectronic Assemblies
Intel Corporation
0 cites
US118879462024
Semiconductor Packages with Antennas
Intel Corporation
0 cites
US118814572024
Semiconductor Packaging with High Density Interconnects
Tahoe Research, Ltd.
0 cites
US117915282023
Low Loss and Low Cross Talk Transmission Lines with Stacked Dielectric Layers for Forming Stubs of Different Thickness or for Forming a Coaxial Line
Intel Corporation
0 cites
US117912772023
Microelectronic Assemblies
Intel Corporation
0 cites
US117841812023
Die Backend Diodes for Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117697512023
Microelectronic Assemblies
Intel Corporation
0 cites
US117644522023
Integrated Circuit Including a Dielectric Waveguide with a Cavity Therein Surrounded by a Conductive Coating Forming a Wall for the Cavity
Intel Corporation
0 cites
US117569432023
Microelectronic Assemblies
Intel Corporation
0 cites
US117496422023
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US117513672023
Microelectronic Package Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117496282023
Sacrificial Redistribution Layer in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117216492023
Microelectronic Assemblies
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US116769182023
Electrostatic Discharge Protection in Integrated Circuits
Intel Corporation
0 cites
US116522642023
Microelectronic Assemblies with Substrate Integrated Waveguide
Intel Corporation
0 cites
US116212362023
Electrostatic Discharge Protection in Integrated Circuits Using Positive Temperature Coefficient Material
Intel Corporation
0 cites
US116160472023
Microelectronic Assemblies
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US116005942023
Microelectronic Assemblies
Intel Corporation
0 cites
US115812722023
Contactless High-frequency Interconnect
Intel Corporation
0 cites
US115812822023
Serializer-deserializer Die for High Speed Signal Interconnect
Intel Corporation
0 cites
US115757492023
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture in Autonomous Cars
Intel Corporation
0 cites
US115694282023
Superconducting Qubit Device Packages
Santa Clara
0 cites
US115629712023
Semiconductor Packages with Antennas
Intel Corporation
0 cites