Patents/Inventors

Adam Gildea

Albany, NYUS9 patents

3 Patents

US126223362026
Bonding Layer and Process
Tokyo Electron Limited
0 cites
US125776652026
Next Generation Bonding Layer for 3D Heterogeneous Integration
Tokyo Electron Limited
0 cites
US125820172026
Bonding Layer and Process
Tokyo Electron Limited
0 cites