Patents/Inventors

Abhishek Anil Sharma

Portland, ORUS48 patents

29 Patents

US126219792026
Multi-tier Memory Structure with Graded Characteristics
INTEL CORPORATION
0 cites
US126220422026
Multi-layered or Graded Gate Dielectric in Thin Film Transistor (TFT) Structures
INTEL CORPORATION
0 cites
US126220182026
Multi-layered or Graded Semiconductor Region in Thin Film Transistor (TFT) Structures
INTEL CORPORATION
0 cites
US126157522026
Stacked SRAM with Shared Wordline Connection
Intel Corporation
0 cites
US126105542026
Multi-storage Element Single-transistor Crosspoint Memory Systems at Low Temperatures
Intel Corporation
0 cites
US126105272026
Integrated Circuit Structures Having Memory Access Transistor with Backside Contact
Intel Corporation
0 cites
US126105822026
Multi-layered Source and Drain Contacts for a Thin Film Transistor (TFT) Structure
Intel Corporation
0 cites
US126044812026
Ic's with Multple Levels of Embedded Memory
Intel Corporation
0 cites
US125988102026
Co-doping of Thin Film Transistors
INTEL CORPORATION
0 cites
US125882412026
Asymmetric Source and Drain Contacts for a Thin Film Transistor (TFT) Structure
INTEL CORPORATION
0 cites
US125884852026
Integrated Circuit Structures Having Airgaps for Backside Signal Routing or Power Delivery
Intel Corporation
0 cites
US125818572026
Integrated Thermoelectric Device to Mitigate Integrated Circuit Hot Spots
Intel Corporation
0 cites
US125722992026
Method and Apparatus to Implement an Integrated Circuit Including Both Dynamic Random-access Memory (DRAM) and Static Random-access Memory (SRAM)
Intel Corporation
0 cites
US125640352026
Airgaps Used in Backend Memory Structures
Intel Corporation
0 cites
US125622152026
Providing Orthogonal Subarrays in a Dynamic Random Access Memory
Intel Corporation
0 cites
US125324802026
Embedded Memory with Double-walled Ferroelectric Capacitors
Intel Corporation
0 cites
US125123652025
Integrated Circuit Interconnect Structures with a Metal Chalcogenide Liner
Intel Corporation
0 cites
US125124092025
Hybrid Etch Stop Layers
INTEL CORPORATION
0 cites
US124988762025
Performing Distributed Processing Using Distributed Memory
Intel Corporation
0 cites
US124904602025
Dielectric Sidewall Features for Tuning Thin Film Transistor (TFT) Parasitics
Intel Corporation
0 cites
US124888322025
Embedded Dynamic Random-access Memory (edram) to Operate Based on Data Access Characteristics
INTEL CORPORATION
0 cites
US124761832025
Punch-through Interconnect Feature to Couple Upper Electrodes of Capacitors of Multi-level Memory Arrays
Intel Corporation
0 cites
US124713622025
Integrated Circuit Structures Having Ultra-high Conductivity Global Routing
Intel Corporation
0 cites
US124446782025
Spacer-based Self-aligned Interconnect Features
Intel Corporation
0 cites
US124367112025
Providing Fine Grain Access to Package Memory
Intel Corporation
0 cites
US124328972025
Cooling Approaches for Stitched Dies
Intel Corporation
0 cites
US123275812025
Embedded Memory Ic's with Power Supply Droop Circuitry Coupled to Ferroelectric Capacitors
Intel Corporation
0 cites
US122117942025
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
Intel Corporation
0 cites
US118307882023
Integrated Circuits and Methods for Forming Integrated Circuits
Intel Corporation
0 cites