11 Patents
- US124865772025Pulsed Plasma (DC/RF) Deposition of High Quality C Films for Patterning
Applied Materials, Inc.
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- US123343942025Methods and Apparatus for Selective Etch Stop Capping and Selective via Open for Fully Landed via on Underlying Metal
APPLIED MATERIALS, Inc.
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- US116035912023Pulsed Plasma (DC/RF) Deposition of High Quality C Films for Patterning
Applied Materials Inc.
0 cites - 0 cites
- US115574662023Tuneable Uniformity Control Utilizing Rotational Magnetic Housing
Applied Materials, Inc.
0 cites - 0 cites
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