10 Patents
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- US120210162024Thermally Enhanced Silicon Back End Layers for Improved Thermal Performance
Intel Corporation
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- US117354952023Active Package Cooling Structures Using Molded Substrate Packaging Technology
Intel Corporation
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- US116768832023Thermoelectric Coolers Combined with Phase-change Material in Integrated Circuit Packages
Intel Corporation
0 cites - US116642942023Phase Change Materials for Electromagnetic Interference Shielding and Heat Dissipation in Integrated Circuit Assemblies
Intel Corporation
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