Patents/Inventors

Aaron Mccann

Queen Creek, AZUS7 patents

7 Patents

US122665892025
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US120573692024
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US118698242024
Thermal Interface Structures for Integrated Circuit Packages
Intel Corporation
0 cites
US118549352023
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US118324192023
Full Package Vapor Chamber with IHS
Intel Corporation
0 cites
US117697532023
Thermally-optimized Tunable Stack in Cavity Package-on-package
Intel Corporation
0 cites
US116794072023
Liquid Metal Thermal Interface Material Application
Intel Corporation
0 cites