Aaron Cadag

6 Patents

• US125435752026

  Bottom Package Exposed Die MEMS Pressure Sensor Integrated Circuit Package Design

  STMICROELECTRONICS, Inc.

  0 cites
• US122550762025

  Method for Manufacturing Leadless Semiconductor Package with Wettable Flanks

  STMICROELECTRONICS, Inc.

  0 cites
• US122117742025

  Lead Stabilization in Semiconductor Packages

  STMICROELECTRONICS, Inc.

  0 cites
• US119292592024

  Method for Manufacturing Leadless Semiconductor Package with Wettable Flanks

  STMICROELECTRONICS, Inc.

  0 cites
• US119160902024

  Tapeless Leadframe Package with Exposed Integrated Circuit Die

  Stmicroelectronics, Inc.

  0 cites
• US115575482023

  Package with Interlocking Leads and Manufacturing the Same

  Stmicroelectronics, Inc.

  0 cites