Patents/Assignees

XINTEC Inc.

20 patents in portfolio

US12598974utility2026
Chip Package and Manufacturing Method Thereof
0 cites
US12500141utility2025
Semiconductor Device Structure and Semiconductor Package Assembly
0 cites
US12487144utility2025
Leakage Detecting Assembly and Sheet Leakage Detecting Module
0 cites
US12473197utility2025
Chip Package
0 cites
US12477848utility2025
Chip Package and Method for Forming the Same
0 cites
US12463102utility2025
Semiconductor Device Structure and Method for Forming the Same
0 cites
US12424567utility2025
Chip Package and Manufacturing Method Thereof
0 cites
US12388034utility2025
Chip Package and Manufacturing Method Thereof
0 cites
US12341109utility2025
Chip Package and Manufacturing Method Thereof
0 cites
US12272712utility2025
Chip Package and Method for Forming a Chip Package Having First and Second Stack of Dummy Metal Layers Surround the Sensing Region
0 cites
US12237354utility2025
Chip Package and Method for Forming the Same
0 cites
US11973095utility2024
Method for Forming Chip Package with Second Opening Surrounding First Opening Having Conductive Structure Therein
0 cites
US11942563utility2024
Manufacturing Method of Chip Package and Chip Package
0 cites
US11935859utility2024
Chip Structure and Manufacturing Method Thereof
0 cites
US11873212utility2024
Chip Package and Manufacturing Method Thereof
0 cites
US11784134utility2023
Chip Package and Manufacturing Method Thereof
0 cites
US11746003utility2023
Chip Package
0 cites
US11749618utility2023
Chip Package Including Substrate Having Through Hole and Redistribution Line
0 cites
US11705368utility2023
Manufacturing Method of Chip Package and Chip Package
0 cites
US11695199utility2023
Antenna Device and Manufacturing Method Thereof
0 cites