- US12575373utility2026Wafer Thinning Tape and Preparation Method Thereof, and Wafer Grinding Method0 cites
- US12252613utility2025Packaging Film and Preparation Method Thereof, and Filter Chip Packaging Method0 cites
- US12098230utility2024Build-up Film with Low Dielectric Loss, Preparation Method Therefor and Circuit Substrate Structure0 cites
- US12024591utility2024Modification Method of Polyphenylene Ether Resin, Laminated Film Composite, Laminated Film, and Substrate0 cites
- US11978686utility2024Chip Protective Film and Method for Manufacturing Same, and Chip0 cites
- US11879076utility2024Composition, Adhesive Film and Chip Packaging Structure0 cites
- US11804463utility2023Underfill for Chip Packaging and Chip Packaging Structure0 cites
- US11767450utility2023Adhesive, Die Attach Film and Preparation Method Therefor0 cites