Patents/Assignees

TONGFU MICROELECTRONICS CO., Ltd.

11 patents in portfolio

US12564083utility2026
Packaging Structure Having Semiconductor Chips and Encapsulation Layers and Formation Method Thereof
0 cites
US12438098utility2025
Packaging Structure and Fabrication Method Thereof
0 cites
US12205828utility2025
Packaging Structure and Fabrication Method Thereof
0 cites
US12119308utility2024
Packaging Structure of Semiconductor Chip and Formation Method Thereof
0 cites
US12074183utility2024
Semiconductor Packaging Method and Semiconductor Package Device
0 cites
US11990398utility2024
Semiconductor Package Device Having Chip Substrate with Pads Around Photosensitive Region
0 cites
US11990432utility2024
Semiconductor Packaging Method and Semiconductor Package Device
0 cites
US11948911utility2024
Semiconductor Packaging Method and Semiconductor Package Device
0 cites
US11948960utility2024
Semiconductor Packaging Method and Semiconductor Package Device
0 cites
US11791310utility2023
Semiconductor Packaging Structure
0 cites
US11670571utility2023
Semiconductor Chip Package Device
0 cites