Patents/Assignees

TONG HSING ELECTRONIC INDUSTRIES, Ltd.

38 patents in portfolio

US12224299utility2025
Sensor Package Structure
0 cites
US12224359utility2025
Sensor Package Structure Having Solder Mask Frame
0 cites
US12189152utility2025
Sensor Lens Assembly
0 cites
US12177996utility2024
Sensor Package Structure
0 cites
US12174446utility2024
Sensor Lens Assembly Having Non-soldering Configuration
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US12119363utility2024
Sensor Package Structure
0 cites
US12113082utility2024
Sensor Package Structure
0 cites
US12108517utility2024
Sensor Lens Assembly Having Non-soldering Configuration
0 cites
US12080659utility2024
Sensor Package Structure
0 cites
US12027545utility2024
Sensor Package Structure
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US11984516utility2024
Sensor Package Structure Having Ring-shaped Solder Mask Frame
0 cites
US11967652utility2024
Sensor Package Structure Having Solder Mask Frame
0 cites
US11792497utility2023
Sensor Lens Assembly Having Non-reflow Configuration
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US11776975utility2023
Sensor Package Structure
0 cites
US11764240utility2023
Method of Manufacturing Image Sensing Chip Package Structure Including an Adhesive Loop
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US11744010utility2023
Sensor Lens Assembly Having Non-reflow Configuration
0 cites
US11735562utility2023
Sensor Package Structure
0 cites
US11723147utility2023
Sensor Lens Assembly Having Non-reflow Configuration
0 cites

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