Patents/Assignees

TANAKA DENSHI KOGYO K. K.

4 patents in portfolio

US12237293utility2025
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using the Same, Semiconductor Device and Manufacturing Method Thereof
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US12087724utility2024
Palladium-coated Copper Bonding Wire and Method for Manufacturing Same
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US11996382utility2024
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Semiconductor Device Using the Same, and Manufacturing Method Thereof
0 cites
US11876066utility2024
Palladium-coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, and Manufacturing Method of Semiconductor Device
0 cites