Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12362285utility2025
Alignment Structure for Semiconductor Device and Method of Forming Same
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US12362283utility2025
Semiconductor Device and Method of Manufacturing the Same
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US12362282utility2025
Semiconductor Structure and Manufacturing Method Thereof
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US12362276utility2025
Semiconductor Package Having a Semiconductor Device Bonded to a Circuit Substrate Through a Floated or Grounded Dummy Conductor and Method of Manufacturing the Same
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US12362275utility2025
Method of Fabricating Package Structure Including a Plurality of Antenna Patterns
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US12362274utility2025
Package Structure and Method of Forming the Same
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US12362273utility2025
Conductive Structures and Methods of Fabrication Thereof
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US12362272utility2025
Semiconductor Structure and Manufacturing Method Thereof
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US12362271utility2025
MIM Structure
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US12362270utility2025
Package Structure and Method of Fabricating the Same
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US12362262utility2025
Semiconductor Device Including Through Die Via
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US12362261utility2025
Semiconductor Device and Method of Manufacture
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US12362260utility2025
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
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US12362256utility2025
Method for Forming Semiconductor Package Structure
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US12362240utility2025
Method and System for Detecting Semiconductor Device
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US12362239utility2025
Self Aligned Contact Scheme
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US12362238utility2025
Metal Gate Process and Related Structure
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US12362235utility2025
Barrier Free Interface Between BEOL Interconnects
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US12362234utility2025
Contact Structure for Semiconductor Device
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US12362231utility2025
Self-assembled Dielectric on Metal Rie Lines to Increase Reliability
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