Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12374655utility2025
Method of Forming Package Structure by Using a Wafer Chuck with Adjustable Curved Surface
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US12374652utility2025
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
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US12374638utility2025
Passivation Structure for Metal Pattern
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US12374637utility2025
Semiconductor Packages and Methods for Forming the Same
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US12374636utility2025
Semiconductor Device Package with Stress Reduction Design
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US12374627utility2025
Method of Fabricating Semiconductor Structure
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US12374617utility2025
Metal-insulator-metal Capacitor Including a Dielectric Pad Layer and Providing a High Capacitance a Low Leakage Current
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US12374616utility2025
Semiconductor Device and Method for Manufacturing the Same
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US12374613utility2025
Semiconductor Structure and Method for Manufacturing the Same
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US12374602utility2025
Semiconductor Structure Having Through Substrate via and Manufacturing Method Thereof
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US12374599utility2025
Package Structure Comprising a Semiconductor Die with Thermoelectric Elements and Manufacturing Method Thereof
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US12374596utility2025
Semiconductor Package and Manufacturing Method Thereof
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US12374595utility2025
Package System and Manufacturing Method Thereof
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US12374590utility2025
Test Structure and Test Method Thereof
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US12374561utility2025
Chip Package Structure with Ring Dam
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US12374548utility2025
Photoresist Layer Outgassing Prevention
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US12374530utility2025
Semiconductor Processing Apparatus for Generating Plasma
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US12374525utility2025
Plasma Processing Tool and Operating Method Thereof
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US12374405utility2025
Memory Device Having Interface Charge Traps
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US12374399utility2025
Semiconductor Memory Devices with Wrapped Word Lines
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