Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12381191utility2025
Semiconductor Package, Method of Bonding Workpieces and Method of Manufacturing Semiconductor Package
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US12381180utility2025
Multi-chip Packages and Methods of Forming the Same
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US12381177utility2025
Package Structure and Method of Fabricating the Same
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US12381176utility2025
Semiconductor Structure Having a Conductive Feature Comprising an Adhesion Layer and a Metal Region Over and Contacting the Adhesion Layer
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US12381166utility2025
Method of Making Semiconductor Structure Including Buffer Layer
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US12381165utility2025
Semiconductor Structure and Method of Manufacturing the Same
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US12381163utility2025
Semiconductor Package and Manufacturing Method Thereof
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US12381148utility2025
Buried Pad for Use with Gate-all-around Device
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US12381145utility2025
Signal Conducting Line Arrangements in Integrated Circuits
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US12381114utility2025
Package Structure with Fan-out Feature
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US12381113utility2025
Semiconductor Device Structure Having Air Gap and Methods of Forming the Same
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US12381092utility2025
Etchant for Etching a Cobalt-containing Member in a Semiconductor Structure and Method of Etching a Cobalt-containing Member in a Semiconductor Structure
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US12381068utility2025
Radio Frequency Screen for an Ultraviolet Lamp System
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US12380959utility2025
Memory Device and Methods
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US12380957utility2025
Memory Device, Layout, and Method
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US12380950utility2025
Non-volatile Static Random Access Memory (NVSRAM) with Multiple Magnetic Tunnel Junction Cells
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US12380948utility2025
RRAM Voltage Compensation
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US12380947utility2025
Systems and Methods to Store Multi-level Data
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US12380946utility2025
Memory Computation Method
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US12380945utility2025
Memory Device with Word Line Pulse Recovery
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