Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12432977utility2025
Semiconductor Device and Method for Manufacturing the Same
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US12432963utility2025
Device Having an Air Gap Adjacent to a Contact Plug and Covered by a Doped Dielectric Layer
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US12432975utility2025
Semiconductor Device with Backside Power Rail
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US12432953utility2025
Finfet Structures and Methods of Forming the Same
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US12432959utility2025
Gallium Nitride-on-silicon Devices
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US12432956utility2025
Method of Manufacturing a Semiconductor Device
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US12432954utility2025
Semiconductor Device Structure with Fin and Method for Forming the Same
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US12432933utility2025
Semiconductor Packages
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US12432929utility2025
Ferroelectric Memory Device with Blocking Layer
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US12432896utility2025
Nanostructure Field-effect Transistors Including Source/drain Features with Asymmetrical Depth
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US12431891utility2025
Glitch Preventing Input/output Circuits
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US12431872utility2025
Semiconductor Circuit and Method for Operating the Same
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US12431452utility2025
Semiconductor Package Including Corner Bumps Coaxially Offset from the Pads and Non-corner Bumps Coaxially Aligned with the Pads
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US12431447utility2025
Semiconductor Device Having a Passivation Layer
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US12431444utility2025
Package Structure Having Trench Capacitor
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US12431435utility2025
Semiconductor Packages and Methods of Forming the Same
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US12431431utility2025
Conductive Structure Interconnects with Downward Projections
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US12431426utility2025
Semiconductor Interconnection Structures Comprising a Resistor Device and Methods of Forming the Same
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US12431423utility2025
Method for Low-cost, High-bandwidth Monolithic System Integration Beyond Reticle Limit
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US12431417utility2025
Semiconductor Package and Method of Manufacturing the Same
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