Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12477647utility2025
Semiconductor Package Assembly and Method of Manufacturing the Same
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US12476217utility2025
Semiconductor Structure
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US12476224utility2025
3DIC Interconnect Apparatus and Method
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US12476213utility2025
Semiconductor Package and Method of Manufacturing
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US12476211utility2025
Semiconductor Device
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US12476210utility2025
Bump Structure and Method of Manufacturing Bump Structure
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US12476206utility2025
Seal Ring for Hybrid-bond
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US12476198utility2025
Package Structure with Adhesive Element Over Semiconductor Chip
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US12476197utility2025
Semiconductor Device
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US12476189utility2025
Semiconductor Device and Method of Manufacturing the Same
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US12476187utility2025
Method and Structure for Metal Tracks in Semiconductor Devices
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US12476182utility2025
Planarization Structure for MIM Topography
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US12476178utility2025
Reduction of Cracks in Redistribution Structure
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US12476166utility2025
Inverted Trapezoidal Heat Dissipating Solder Structure and Method of Making the Same
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US12476157utility2025
Semiconductor Packages and Method of Manufacturing the Same
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US12476150utility2025
Critical Dimension Uniformity (CDU) Control Method and Semiconductor Substrate Processing System
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US12476142utility2025
Semiconductor Device Structure and Methods of Forming the Same
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US12476137utility2025
Method to Enlarge an Opening in Air Gap Formation
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US12476133utility2025
Semiconductor Structure and Method for Manufacturing the Same
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US12476126utility2025
Wafer Holder Assembly
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