Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12489074utility2025
Package Structure Having a Device Inside a Molding Member and Method of Forming the Package Structure
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US12489065utility2025
Fabrication Method of Semiconductor Structure
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US12489064utility2025
Method for Forming Mark, Packaging Method of Semiconductor Device, and Semiconductor Device Having the Mark
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US12489063utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12489062utility2025
Semiconductor Package and Manufacturing Method Thereof
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US12489049utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12489045utility2025
Package Structure with Through Vias
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US12489030utility2025
Methods of Manufacturing Integrated Fan-out Packages with Embedded Heat Dissipation Structure
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US12482791utility2025
Stacked Integrated Circuits with Redistribution Lines
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US12482790utility2025
Packages with Stacked Dies and Methods of Forming the Same
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US12480204utility2025
Physical Vapor Deposition Apparatus
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US12482773utility2025
Integrated Circuit Structure, and Method for Forming Thereof
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US12482772utility2025
Bonding Structure of Dies with Dangling Bonds
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US12482763utility2025
Semiconductor Device Package and Methods of Formation
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US12482757utility2025
Semiconductor Packages and Methods of Manufacturing Thereof
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US12482743utility2025
Interconnect Structure and Method for Forming the Same
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US12482717utility2025
Techniques for Heat Dispersion in 3D Integrated Circuit
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US12482703utility2025
Semiconductor Device Having Thermally Conductive Air Gap Structure and Method for Manufacturing the Same
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US12482698utility2025
Testing Structure for an Integrated Chip Having a High-voltage Device
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US12482682utility2025
Systems and Methods for Inspection Stations
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