Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11552103utility2023
Three-dimensional Stackable Ferroelectric Random Access Memory Devices and Methods of Forming
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US11552205utility2023
Optical Sensing Device Having Inclined Reflective Surface
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US11552195utility2023
Semiconductor Devices and Methods of Manufacturing Thereof
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US11545457utility2023
Semiconductor Package, Redistribution Structure and Method for Forming the Same
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US11542151utility2023
MEMS Apparatus with Anti-stiction Layer
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US11542153utility2023
Segmented Pedestal for Mounting Device on Chip
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US11543754utility2023
Extractor Piping on Outermost Sidewall of Immersion Hood Apparatus
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US11545201utility2023
Memory Device with Unipolar Selector
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US11545443utility2023
Method for Forming Hybrid-bonding Structure
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US11545438utility2023
Semiconductor Packages and Methods of Forming the Same
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US11545429utility2023
Interconnect Structures Having Lines and Vias Comprising Different Conductive Materials
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US11545400utility2023
Methods of Cutting Metal Gates and Structures Formed Thereof
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US11545399utility2023
Finfet EPI Channels Having Different Heights on a Stepped Substrate
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US11545395utility2023
Techniques for Wafer Stack Processing
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US11545507utility2023
Memory Device and Method for Making Same
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US11545202utility2023
Circuit Design and Layout with High Embedded Memory Density
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US11545392utility2023
Semiconductor Component Having Through-silicon Vias
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US11545382utility2023
Integrated Chip Die Carrier Exchanger
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US11545370utility2023
Method for Forming Pattern and Manufacturing Method of Package
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US11545218utility2023
Nonvolatile SRAM
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